AIT has developed temporary bonding adhesive on disposable carrier. Traditional temporary bonding adhesives for wafer processing have always required a carrier to match carrier-device wafer CTE during the rigors of processing. By eliminating the traditional glass carrier or silicon wafer carrier, wafer per hour throughput is greatly increased.
To successfully enable wafer processing with disposable carrier the key is the innovative, molecularly engineered temporary bonding adhesive: highly conforming, stretchable, and flexible temporary bonding adhesive yet with high shear bonding strength and high-temperature stability.
This novel solution cuts down the time, cost, and resources required for wafer processing by removing carrier bonding, carrier debonding, and carrier cleaning steps traditionally required.
These novel temporary bonding adhesives can also be used with traditional wafer processing glass or wafer carrier (hyperlink).